| 技术参数|TECHNICAL PARAMETER |
| 类别 CATEGORY | 项目 ITEM | 规格参数 SPECIFICATION |
| 视觉识别系统 Recognition System | 判别方法 Inspection | 综合拥有权值成像数据差异分析技术,彩色图像对比,颜色矢量分析技术,相似性,二值化, OCR字符识别,OCV外形轮廓分析技术,锡珠功能检测,波峰焊插针检测等多种算法 Usingmultiple algorithms syntheticaly such as WIDM.Color Image contrast technology.Color vector analysis,similarity,two- value handling technology DCR Contour analysis,Solder ball nspection and Wave DIP analysis technology and s on |
| | 相机 Camera | 500万像素彩色相机,分辨率:20μm(可选15μm,10μm) 5MP Color camera:20μm(15μm,10μm for option) |
| | 光源 Lamp-house | RGB三色环形LED结构光源.特殊辅助同轴光源(选配). 3Rngs RGB LED lamp-house,withspecial coaxial optical for option. |
| | 图像处理速度 | 0201元件 0201 Chip | ≤10ms(标准高度) |
| | mageProcessing Speed | 每画面处理时间 Per-image Time | ≤170ms(标准高度) |
| | | 锡膏印刷 Paste Printig Defects | 有无,偏斜,少锡,锡,断路,污染 Misaligned,overflow,insufficient,pasting open,stain |
| | | 零件缺陷 Compones Defects | 缺件,偏移,歪斜,立碑,侧立,翻件,极性反,错件,破损 Missing,misaligned,skewed,tombstone,billboard,overturn,reversed polarity,wrong.damaged |
| | 检测内容 Inspection ltems | 焊点缺陷 SolderDefects | 锡多,锡少,连锡,脏污,虚焊 Overflow,insufficient,short solder,stain,false soder |
| | | 波峰焊检测 Wave Soldering Inspect | 多锡,少锡,短路,苞焊,沙孔 Overflow,insuffidient,short,Excess Solder,solder void |
| | 防静电措施 Anti Static Measures | 防静电插座,配防静电手环 Antistatic electric outlet,anti-static wreath |
| 机械系统 MechanismSystem | PCB尺寸(L×H) PCB Size | 25×25mm~480×330mm,(可根据客户要求定制更大尺寸) can make bigger size accordingto clients demands |
| | P C B 厚 度 PCB Thickness | 0.5mm-5.0mm |
| | P C B 翘 曲 度 PCB Warp Toleranoe | ±2mm(有夹具辅助矫正变形 |
| | 零件高度 Component Clearance | TOP<28/option:55mm;BOT<75mm |
| | 最小零件 MinimumSpace Parts | 20um:0201Chip,0.4PitchlC, 15um:01005Chip,0.3Pitch IC |
| | X , Y 平 台 X,YPlatform | 驱动设备 Driber | 交流伺服电机系统 AC servo system |
| | | 定位精确 Orlentation | <10μm |
| | | 移动速度 Moving Speed | 700 mm/s |
| 软件系统 Soft System | 操作系 Operation S | 统 ystem | Microsoft Windows 10 |
| | 识别控制系统 | 特点 Characteristics | 自动程序调用,板面正反面自动识别；支持无板编程；智能通讯功能,可对接生产管理系统；智能数据 警报功能；支持中央集中数据库模式. Automatic call the program &identify the top or bottom side of the PCB;Support no PCB programming;Intelligent communication,dockingwith MESIntelligent dataalert function;Support the centralcentralzed database model |
| | Controlling&Recognizing | 操作 Operation | 图形化编程,操作简单易学；多种算法可自由搭配组合；支持离线编程和离线调试；可自动生成统 计报告 Graphical programming.easyto operate;Multiple algorithms can be free combination;Support ofline programming & debugging:Automatically generate SPC reports. |
| | Mark | 点数 Mark Numbers | 可选择3个常用的Mark点或多个Mark点使用 3marks can be chosen |
| | | 识别速度 Recognising Speed | 0.5s/pcs |
| 控制系统 Controler | 电脑主机 Computer | 工业控制计算机,17 CPU,16G DDR内存,2TB硬盘 ndustrial Computer l3 CPU,I3 CPU,Memory16G,Hard disk 2T |
| | 显示 pispla | 22寸液晶宽屏显示器 22 inch TFT |
| 其它参数 Others | 设备外形尺寸 Machine Dimensons(L×WxH) | 868×1055×1365mm |
| | 重量 WEIGHT | ~310kg |
| | 电源 Power Supply | 交流220伏特±10%,频率50/60Hz,额定功率600W AC220V±10%,single phase 50/60HZ,power consumption 600W |
| | 使用环境 Working Enyironment | 温度10-40℃,湿度30- 80%RH Temperature10-40℃,humidity 30-80%RH |
