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500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

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500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

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Brand Name : YUSHUNLI

Model Number : YSF4/46

Certification : CE ISO

Place of Origin : China Dongguan

MOQ : 1set

Price : USD1000~10000

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 80Sets/Month

Delivery Time : 10-15work days

Packaging Details : plywooden case

Dimension(L×W×H) : 950 x 1776 x 1565 (mm)

Transport width adjustment : 50-460 (mm)

PCB size : 500 x 460 (mm)

Conveyor height : 900±20(mm)

Nitrogen consumption : 1.5-2m³/h/potx1

Flux module x axis distance (max.) : 510mm

Flux module y axis distance (max.) : 450mm

Max. nozzle speed : 7m/min

Nozzle : 130 μm, alternative diameter

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500 X 460 (Mm) Pcb Size High Quality Selective Soldering Flux Spray Module/Reflow Oven

Specification:

MODEL
YSF4/46
YSS4/46

Equipment parameters
Dimension(L×W×H)
950 x 1776 x 1565 (mm)
1700 x 1776 x 1565 (mm)
Transport Parameters
Transport width adjustment
50-460 (mm)
50-460 (mm)
PCB size
500 x 460 (mm)
500 x 460 (mm)
Conveyor height
900±20(mm)
The soldering system
Solder pot
electromagnetic pump tin solder pot
The amount of tin dross
0.5KG/pot/week x1
Nitrogen consumption
1.5-2m³/h/potx1
solder pot numbers
single pot/dual pots/dual pots individual control

500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

FLUX SPRAY MODULE

Introduction:
The spray head which is imported from Germany offers an absolutely precise and well defined flux deposition on even the smallest areas. The flux is targeted to beapplied only to the solder joint,whereby the wettable area can be as small as 3mm.with the effect that ionic contamination is minimized and flux consumption is duced.

Features:
Saving 90%flux compared to traditional mode. The wettable area can be as small as 3mm, minimize the effect of ionic contamination, meanwhile boards cleaning free. Two axis servo motor control, high positioning accuracy. Minimum ionic contamination.

Specifications:
Flux module x axis distance (max.)
510mm
Flux module y axis distance (max.)
450mm
Max. nozzle speed
7m/min
Flux content
2 L
Flux type
RO, RE and OR and with the effective standard of L0, L1, M0, according to IEC 61190-1-1
Flux effective level
L0, L1, M0
Nozzle
130 μm, alternative diameter
Spray pressure
0.5~1.0 bar
Spray width
2~8 mm (with spray nozzle 130 μm)
Spray speed
20 mm/s
Positioning speed
400 mm/s
Positioning accuracy
±0.2 mm
Flux system
2-axis With Servo Drive

500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

PREHEATING MODULE

Introduction:
The current selective soldering processes, in particular those for lead-free soldering, multi-layer boards or high mass components, call for increased preheat capacities. Short wave IR heater on the bottom and hot air convective preheating on the top, toensure preheating evenly.

Features:
1, Segmented & modular layout, preheating more flexibly.
2, Lower short wave IR preheating on the bottom,increasing the efficiency.
3, Hot air convection preheating on the top, preheating more evenly (optional).

Top heater power
4KW
Top heater voltage
220V
Bottom heater powerr
4.8KW
Bottom heater voltage
220V
CDA pressure
0.5-0.7MPa

500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven

SOLDERING MODULE

Advantages Of Using Induction Pump:
1,3-axis servo drives, high control precision.
2,Min.nozzle diameter is 3mm,point or track soldering available according to different through hole components.
3,Max.solder wave height is 5mm and controllable,soldering climb rate increased largely.
4,Dual-pot optional, highest flexible.
5,Nitrogen protection, only minute amounts of dross.
6,Pot temperature are continuously monitored.
7,Wave height monitoring available.
8,Solder level monitoring available.
9,No mechanical movement and no wearing.

Specifications:
Solder nozzle position
Middle
Solder content
13 Kg
Max. soldering temperature
350 °C
Min. internal diameter of solder nozzle
3 mm, External Diameter 4.5 mm
Max. Solder wave height
5 mm
Soldering speed X,Y-axis
10 mm/s
Positioning speed X,Y-axis
200 mm/s
Positioning speed Z-axis
100 mm/s
Positioning accuracy
±0.15 mm
Max.solder distance(x axis)
510mm
Max.solder distance(y axis)
460mm
Max.distance of z-axis
58mm
Max.pot moving speed
5.8m/min
Control system
3-axis With Servo Drive

500X460mm PCB Selective Soldering Lead Free Solder Reflow Oven


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